Schematic capture, multilayer layout, signal integrity, and DFM under one accountable team. Designs that route on the first spin and assemble cleanly on our SMT lines.
Design → DFM → SMT → Inspection → Testing → Delivery. Each transition is documented, inspected, and signed off — so the board you ordered is the board that ships.
Schematic + multilayer layout against your spec, with stackup and impedance targets locked.
10-point pre-tapeout review against our fab's actual capability file. Iteration loop here saves a spin.
Lines 1–4 at Madurai, fine-pitch BGA and 0201 placement at 80k CPH with paste verification.
100% AOI on top and bottom, X-ray on BGA voids, plus IPC-A-610 visual sign-off.
ICT for high-volume, flying probe for low-volume, plus functional test against your firmware.
ESD-safe packaging, MBB + desiccant for export, full traceability pack with every shipment.
Each capability is a discipline our design team runs to its own checklist — with specific limits and tolerances you can hand to your customer's audit team.
From 2-layer single-sided boards to 16-layer high-density stackups with controlled impedance — sized to your escape routing, signal speed, and cost targets.
DDR4/5, PCIe Gen4/5, USB 3.x SS and Ethernet routed against measured impedance targets with controlled differential pairs and disciplined return paths.
RF microstrip / stripline for sub-6 GHz and mmWave; tight power layout for DC-DC converters and IGBT/MOSFET stages with snubber and gate-drive isolation.
Stackup-aware impedance design with per-panel test coupons. Documented impedance reports ship with every prototype lot.
Plane decoupling, return-path discipline, and ground-stitching strategy refined for pre-compliance success. Saves the second trip to the EMC chamber.
Every design passes our 10-point DFM review before tapeout: annular ring, courtyard, panelisation, fiducials, testpoint coverage, mask slivers, plane splits.
These thresholds describe the design window we'll quote against without question. Tighter targets are possible — ask, and we'll let you know what changes.
| Specification | Value |
|---|---|
| Layer count | 2 – 16 layers |
| Min trace / spacing | 3 mil / 3 mil |
| Min via | 0.15 mm drill, 0.30 mm pad |
| BGA pitch | 0.4 mm and above |
| Annular ring (inner) | ≥ 0.075 mm (IPC Class 3) |
| Controlled impedance | ±10% (±7% for PCIe Gen4+) |
| Material | FR-4 Tg 150 / 170, polyimide for rigid-flex |
| Copper weight | 1 oz / 2 oz outer · 0.5 / 1 oz inner |
| Surface finish | ENIG, HASL, OSP, immersion silver |
| Standard turnaround | Layout: 5–10 days · Prototype: 7–14 days |
We accept native project files from the major EDA suites and sign-off simulators — no format-conversion gymnastics, no "please re-export as Gerber."
Selected articles from the PCB Design & Engineering corpus — DFM, impedance, signal integrity, and the calls we make before tapeout.
Send what you have — schematic, BOM, mechanical drawing, or just a target spec — and we'll come back within two working days with a manufacturability review and a quote.