Full turnkey from BOM to finished product — embedded systems, industrial control boards, box build, integration, and final test. Shipped under your label, when required.
Engineering → BOM → Assembly → Integration → Test → Delivery. The handoffs that usually fragment across vendors run on a single shop floor with one accountable team.
DFM + DFT review of your design, BOM verification, and test-plan co-development with your engineering team.
Sourcing, counterfeit screening on grey-market lines, kitting, and consignment of customer-supplied parts.
PCB assembly on the SMT line, through-hole on selective wave, cable build, and sub-assembly stitching.
Final mechanical assembly, firmware flash, serial / MAC / key provisioning, in-house functional test.
Functional test, optional burn-in, optional environmental stress (vibration / thermal cycle) per your spec.
ESD-safe packaging with MBB + desiccant, customs docs, drop-ship or palletised export to your distribution point.
Each capability is a discipline we run to our own checklists — with specific limits and tolerances you can hand to your customer's qualification team.
Turnkey embedded-board manufacturing built around the MCU and SoC families your design uses — STM32, NXP, TI Sitara, Microchip PIC32. Firmware-aware test fixtures included.
24V / 48V industrial PSUs, RS-485 / CAN / Modbus interfaces, isolation-class layouts, and conformal coating for outdoor and harsh-environment deployments.
Cable assembly, fastening, enclosure preparation, labelling, and torque-controlled fastening — full mechanical integration of populated PCBAs into the final product housing.
System-level assembly: PCBA + display + housing + cabling + firmware load. We provision serial numbers, MAC addresses, and any cryptographic identities at integration.
Functional test against your spec, burn-in for harsh-environment deliverables, ESD-safe packaging with desiccant and indicator cards, and per-unit traceability records.
Drop-ship to your customer, kitting, partial-build with consigned components, customs documentation, and end-customer-branded packaging when required.
Volumes, lead-times, and standards we hold by default. Tighter targets are negotiable — ask, and we'll let you know what changes.
| Specification | Value |
|---|---|
| Production volume | Prototype (5 +) · pilot (50 +) · mass (10,000 + /month) |
| Lead-time (typical NPI) | 4 weeks prototype · 8 weeks pilot · 12 weeks ramp |
| Mixed-tech capability | SMT + through-hole + box build on single panel |
| Burn-in | 168 h standard · 1000 h on request · accelerated profiles available |
| Conformal coating | Acrylic, silicone, parylene — in-house |
| Cable assembly | AWG 30 – 8, sealed / non-sealed connectors |
| Calibration & provisioning | Per-unit serial / MAC / cryptographic key load |
| Inspection & test | AOI · X-ray · ICT · FCT · environmental (on request) |
| Standards | IPC-A-610 Class 2 / 3 · IPC/WHMA-A-620 (cables) · ISO 9001 |
| Industries served | Automotive · Industrial · Medical · Telecom · Consumer · IoT |
A representative snapshot of the OEM programmes we currently run for Tier-2 customers across automotive, medical, industrial automation, and IoT.
Selected articles from the OEM Manufacturing corpus — box-build pitfalls, cable QC, burn-in economics, ESD-safe export packaging, and the prototype-to-mass handoff.
Share your design, BOM, mechanical drawings, and target volume — and we'll come back within two working days with a programme plan, lead-time, and a price tier for prototype through to mass production.