Four placement lines, fine-pitch BGA capability, and per-board traceability — built into nine decades of Pioneer Group manufacturing discipline.
Design → DFM → SMT → Inspection → Testing → Delivery. Every transition is documented and signed off — and every board carries a serial linking back to the materials and operators behind it.
DFM walkthrough on your Gerbers, panelisation plan, and component verification against our incoming-inspection records.
Stencil aperture design, paste-volume targets, and reflow profile derived from the dominant package on the board.
Print → place → reflow on the dedicated line for your build. AOI between print and place if your design needs it.
AOI top + bottom on every board, X-ray on BGA/QFN voids, IPC-A-610 visual sign-off by trained operators.
ICT or flying probe per quantity tier; functional test against your firmware; burn-in for boards destined for harsh environments.
ESD-safe pack, moisture-barrier bagging for export, traceability pack and FAI report ship with the lot.
Each capability is a discipline the line runs to its own thresholds — with specific tolerances you can hand to your customer's audit team.
Four high-speed placement lines at our Madurai facility running 0201 components and beyond at production cadence — with stencil paste verification on every print.
Selective wave soldering for mixed-tech boards. We run THT on the same panel as fine-pitch SMT without cooking the small parts — pin-count economics decide hand-solder vs selective.
BGA, QFN, and µBGA placement with X-ray void verification on every package. Void rates under 8% on power BGAs; rework profiles available for eight common package sizes.
100% AOI top and bottom on every board, tuned per design to keep false-fail rate low without missing real defects. X-ray for BGA voids and joint integrity on safety-critical builds.
ICT fixtures for high-volume programmes, flying probe for low-volume, and functional test against your firmware. We build the test plan with your team, not after.
Every board carries a serial that links solder-paste batch, reel lot, profile run, and operator — auditable end to end. ESD-controlled floor aligned to ANSI/ESD S20.20.
These are the SMT-line capabilities we'll quote against without further qualification. Tighter targets are possible — ask and we'll let you know what changes.
| Specification | Value |
|---|---|
| Smallest passive | 01005 / 0201 |
| BGA / QFN pitch | 0.4 mm minimum |
| Placement speed | Up to 80,000 CPH peak |
| Board size range | 50 × 50 mm to 460 × 410 mm |
| Board thickness | 0.4 – 4.5 mm |
| Component height | Up to 25 mm |
| Solder | Pb-free SAC305 / SAC0307 · leaded on request |
| Inspection | 100% AOI + X-ray (BGA) + ICT / FCT |
| Standards | IPC-A-610 Class 2 / Class 3 |
| Production tier | Prototype (5–50) · pilot · mass production (10k+) |
A representative slice of the placement, print, reflow, inspection, and test equipment that runs the Madurai SMT floor — updated as we add capacity.
Selected articles from the SMT Assembly corpus — BGA voiding, reflow profiles, paste storage, AOI tuning, and the calls we make at production speed.
Two working days for a manufacturability review, a lead-time, and a unit-price tier — with the assumption that the answer ends in your design hitting our line, not coming back as a revision.