What the AEC-Q200/Q100/Q104 family actually demands of your BOM and assembly process, and where Indian Tier-2 suppliers most often fall short.
Patient-applied-part isolation, single-fault safety, and the documentation trail we keep so customers can clear their notified-body review the first time.
Capacitor selection, conformal coating choice, and the burn-in protocols that separate boards that last 18 months from boards that run a decade.
Counterfeit-parts plans, configuration management, special-process control: how a PCB and assembly supplier maps cleanly into your AS9100D framework.
Loop inductance, gate-drive isolation, and snubber sizing for the 1000V-class IGBTs we routinely place — with measured ringing data before and after layout tweaks.
Can-shield selection, gasket compression, and the thermal-path engineering needed when your PA dissipates 12W under a 3mm-deep enclosure lid.
Why your dev-board antenna pattern collapses when you put it in production housing, and the tuning loop we run between EM-sim and chamber measurement.